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Intel Xeon W5590 - AT80602000753AA (BX80602W5590) information

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Type:CPU Manufacturer:Intel
family:Xeon microprocessors:Xeon 5500
Type CPU / Microprocessor
Market segment Server
Family
Intel Xeon 5500
Model number   
W55*0
CPU part numbers
  • AT80*02000*53AA is an OEM/tray microprocessor
  • BX80*02W55*0 is a boxed microprocessor
Frequency    3333 MHz
Turbo frequency 3*00 MHz
Bus speed    *.4 GT/s QPI (3200 MHz)
Package 13**-land Flip-Chip Land Grid Array (FC-LGA8)
1.**" x 1.**" (4.5 cm x 4.25 cm)
Socket Socket 13** / B / LGA13**
Introduction date Aug *, 200*
End-of-Life date Last order date is September 28, 2012
Last shipment date for tray processors is March 2*, 2015
Price at introduction $1*00
S-spec numbers
  ES/QS processors Production processors
Part number Q1GW SLBGE
AT80*02000*53AA + +
BX80*02W55*0   +
Architecture / Microarchitecture
Microarchitecture Nehalem
Platform Tylersburg-EP
Tylersburg-EN
Tylersburg-WS
Processor core    Nehalem-EP
Core stepping    D0 (Q1GW, SLBGE)
Manufacturing process 0.045 micron
*31 million transistors
Die size 2*3mm2
Data width *4 bit
The number of cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size    4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size    4 x 25* KB 8-way set associative caches
Level 3 cache size 8 MB 1*-way set associative shared cache
Physical memory 144 GB
Multiprocessing Up to 2 processors
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4   
  • EM*4T / Extended Memory *4 technology / Intel *4   
  • NX / XD / Execute disable bit   
  • HT / Hyper-Threading technology   
  • VT-x / Virtualization technology   
  • VT-d / Virtualization for directed I/O
  • TBT / Turbo Boost technology   
Low power features
  • Thread C1/C1E, C3 and C* states
  • Core C1/C1E, C3 and C* states
  • Package C1/C1E, C3 and C* states
  • Enhanced SpeedStep technology   
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 3
Supported memory: DDR3-800, DDR3-10**, DDR3-1333
Maximum memory bandwidth (GB/s): 32
ECC supported: Yes
Other peripherals Quick Path Interconnect (2 links)
Electrical / Thermal parameters
V core    0.*5V - 1.35V
Maximum operating temperature    **°C
Thermal Design Power    130 Watt


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